G. Sharon, “Addressing Key Mechanical Failure Mechanisms in High Tech Electronics Applications,” Simulation World Canada Innovation Conf., Ottawa, Canada, May 30, 2024
Panelist, “How Can We Enable a Silicon to Systems Vision Using Our Multiphysics Workflows?” Ansys Internal Presentation, Ansys Multiphysics Summit, Canonsburg, PA, Jun. 2024
G. Sharon, “Addressing Key Mechanical Failure Mechanisms in High Tech Electronics Applications,” Simulation World Canada Innovation Conf., Ottawa, Canada, May 17, 2023
J. Yang, G. Sharon, “High Fidelity or Low Simulation Time, Why Not Both?” Ansys Internal Presentation, Ansys Mechanical Summit, Canonsburg, PA, Feb. 2023
G. Sharon, “Leveling Up in STEM,” Society of Hispanic Professional Engineers, University of Maryland Chapter, College Park, MD, Mar. 15, 2022
N. Blattau, M. Blattau, N. Kirsch, G. Sharon, T. Ferris, “How to Use Simulation and Modeling Techniques to Improve Reliability,” Electronics Reliability Tutorial Series, October 7, 4 and 21,2021, 3-part series offered via Webinar, IEEE Boston Section
https://ieeeboston.org/electronic-reliability-tutorial-series-2/
G. Sharon, N. Blattau, M. Serebreni, G. Caswell, “Reliability Physics Analysis (RPA) of Semiconductor Packaging,” Chip Scale Review, pp. 27-29, Jul.-Aug. 2019
M. Serebreni, N. Hernandez, G. Sharon, N. Blattau, C. Hillman, K. Symonds, “Improved Correlation Between Accelerated Board Level Reliability (BLR) Testing and Customer BLR Results Using a Hybrid Closed-Form/Finite Element Methodology,” 2019 IEEE 69th Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May 2019, pp. 2103-2111
https://ieeexplore.ieee.org/document/8811203
M. Serebreni, G. Sharon, N. Blattau, and C. Hillman, “Reliability Physics Approach for High-Density Ball Grid Arrays in Autonomous Vehicle Applications,” SAE Int. J. Adv. & Curr. Prac. in Mobility 1(4):1640-1647, 2019, doi: 10.4271/2019-01-1251
https://www.researchgate.net/publication/332155827_Reliability_Physics_Approach_for_High-Density_Ball_Grid_Arrays_in_Autonomous_Vehicle_Applications
M. Serebreni, P. McCluskey, T. Ferris, G. Sharon, N. Blattau, C. Hillman, “Modeling the Influence of Mold Compound and Temperature Profile on Board Level Reliability of Single Die QFN Packages,” 19th Int’l. Conf. Thermal, Mech. and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Toulouse, France, Apr. 2018, pp. 1-8
https://ieeexplore.ieee.org/document/8369869
G. Sharon, N. Blattau, M. Serebreni, G. Caswell, “Modeling Modes for Failure Chip-Package Interactions and Package Level Reliability,” Advancing Microelectronics 45(6), pp. 6-10, 2018 (feature article)
https://www.researchgate.net/publication/330999015_Modeling_modes_for_failure_chip-package_interactions_and_package_level_reliability
G. Sharon, C. Hillman, N. Blattau, “Automotive Electronics in Harsh Environments,” 30th Electronics Packaging Symposium, Binghamton, NY, Sep. 18-19, 2018
M. Serebreni, N. Blattau, G. Sharon, C. Hillman, P. McCluskey, “Semi-Analytical Fatigue Life Model for Reliability Assessment of Solder Joints in QFN Packages Under Thermal Cycling,” Proc. Int’l. Conf. Soldering and Reliability, Toronto, Canada, Jun. 2017
https://www.researchgate.net/publication/317569529_SEMI-ANALYTICAL_FATIGUE_LIFE_MODEL_FOR_RELIABILITY_ASSESSMENT_OF_SOLDER_JOINTS_IN_QFN_PACKAGES_UNDER_THERMAL_CYCLING
M. Serebreni, N. Blattau, G. Sharon, C. Hillman, “Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling,” IPC APEX Expo, San Diego, CA, Feb. 2017
https://www.researchgate.net/publication/312084267_Effect_of_Encapsulation_Materials_on_Tensile_Stress_during_Thermo-Mechanical_Cycling_of_Pb-Free_Solder_Joints
G. Sharon, V. Doan, C. Hillman, N. Blattau, “Effective Use of Reliability Simulation in an Agile Development Process,” Int’l. Applied Reliability Symposium, San Diego, CA, Jun. 21-23, 2016
M. Howard, G. Caswell, C. Hillman, N. Blattau, P. Waters, G. Sharon, F. Pitelli, “Automate 3D Modeling of Trace and Via Structures,” IMAPS 11th Int’l. Conf. and Exhib. Device Packaging, Fountain Hills, AZ, Mar. 16-19, 2015
https://www.researchgate.net/publication/283276741_Automate_3D_Modeling_of_Trace_and_Via_Structures
G. Sharon, G. Caswell, N. Blattau, C. Hillman, “Predicting Package Level Failure Modes in Multi Layered Packages,” 48th Int’l. Symposium on Microelectronics, Orlando, FL, Oct. 26-29, 2015
https://www.researchgate.net/publication/284750160_Predicting_Package_Level_Failure_Modes_in_Multi_Layered_Packages
G. Sharon, C. Tulkoff, “Temperature Cycling and Fatigue in Electronics,” Proc. SMTA Int’l. Conf., Rosemont, IL, Sep. 30-Oct. 1, 2014
https://www.researchgate.net/publication/306135282_Temperature_cycling_and_fatigue_in_electronics
G. Sharon, C. Tulkoff, “Design for Reliability of Electronics in Automotive Applications,” Automotive Sensors and Elec. Conf. MEMS Forum, Detroit, MI, Feb. 17, 2013
G. Sharon, R. Oberc, D. Barker, “Assessing the Dynamic Failure Response of MEMS Structures,” Int’l. J. Structural Integrity, Vol. 4, Issue 2, pp. 191-205, 2013
https://www.emerald.com/ijsi/article-abstract/4/2/191/152250/Assessing-the-dynamic-failure-response-of-MEMS?redirectedFrom=fulltext
A. Syed, G. Sharon, R. Darveaux, “Factors Affecting Pb-Free Flip Chip Bump Reliability Modeling,” 62nd IEEE Elec. Comp. & Tech. Conf., San Diego, CA, May 29-Jun. 1, 2012
https://ieeexplore.ieee.org/abstract/document/6249069
G. Sharon, D. Barker, “Modeling of Plated Through Hole Reliability and Performance,” J. Multidiscipline Modeling in Materials and Structures (MMMS), 7(3): 306-317, 2011
https://www.emerald.com/mmms/article/7/3/306/294767/Modeling-of-plated-through-hole-reliability-and?utm_source=researchgate.net&utm_medium=article
G. Sharon, D. Barker, “Modeling Stress Responses of Multi-Layer Capacitors Using Varying Termination Geometries,” Journal of Failure Analysis and Prevention, 11(5): 546-551, 2011
https://link.springer.com/article/10.1007/s11668-011-9480-x
G. Sharon, D. Barker, “Crack Growth and Reliability Modeling of Multi-layer Capacitors in Microelectronics Applications,” Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X, Proc. SPIE Photonics West, vol. 7928, Feb. 18, 2011
https://www.spiedigitallibrary.org/conference-proceedings-of-spie/7928/79280D/Crack-growth-and-reliability-modeling-of-multi-layer-capacitors-in/10.1117/12.871536.full